SENTECH Cluster Tools comprise plasma etching and / or deposition modules, transfer chamber and vacuum load lock or cassette station for flexibiliy in wafer handling.

SENTECH Cluster Configurations can be used to process a large variety of substrates from 100 mm wafers up to 200 mm in diameter. The systems offer different levels of automation ranging from vacuum cassette loading to a one-process chamber for up to a six-port cluster configuration, with different etch and deposition modules offering high flexibility and high throughput. All SENTECH Cluster Systems are controlled by advanced hardware and SIA operating software, with a client-server architecture. A well-proven, reliable programmable logic controller (PLC) is used for the real-time control of all components.